Fairphone Case #6: Wave Pattern
Fairphone Case #6: Wave Pattern
3D
Published 2017-05-15T11:53:07+00:00
Inspired by the Fairphone designaday (http://designaday.fairphone-open.com/) I designed some cases for the Fairphone.
I hope you like it. Let me know in the comments what Ideas you would like to see for the case of your Fairphone.
Choosing the orientation in which to print was difficult. The first choice was to print open side up. This required a small amount of support under the cover design, similar to a raft. Unfortunately this support was difficult to remove. The second choice was to print open side down. This required a large amount of support, 32g in fact, but this proved very easy to remove and the design was printed well. A third choice of vertical was rejected as the side are slightly convex and would not provide a base base for printing. I printed this at 200 micron resolution. 100 micron would be a better choice to provide for a smoother design. A semi-flexible material, such as a TPU would be a good choice. I would also recommend a dual extrusion printer where a more rigid support under a TPU material would make an excellent combination.
| Date de publication | 15/05/2017 |
| Durée d’impression | 90 - 180 minutes |
| Quantité de filament | 53g |
| Dimensions | 132x66x16mm |
| Technologie | FDM |
| Complexité | Medium |